3M™ UV-Curable Adhesive LC-3200 is ideal for the temporary bonding and debonding process (TBDB) for silicon wafers to support glass carriers during semiconductor processing. The adhesive is cured by UV light, reducing the need for heat and helping streamline semiconductor TBDB process flows. This UV-curable adhesive is used as part of the 3M™ Wafer Support System.
3M™ Transbond™ LR Light Cure Adhesive
3M Channel Bonding and Sidelite Adhesive, 08641, 47.3
3M Structural UV-curing Adhesives for Electronics
Temporary Bonding & Debonding - Semiconductor
3M TALC Plastic Adhesive 2262, Clear: Industrial Adhesives
Acrylic adhesive / wafer / UV-curable - 3500 CP
Semiconductor Industry Solutions
3M Marine Adhesive Sealant 4000 UV (05280), Medium Strength
LORD Signlok 406 (225mL Cartridge) – Being Discontinued Due to
UV Adhesives ConRo Electronics
UV Light Curable Adhesives Glue Supplier UV Cured Adhesives