New Highly Flexible Silver Conductive Epoxy Adhesive

Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more rapidly at elevated temperatures.

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Electrically Conductive Adhesives

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EP21TDCSFL Product Information

CHO-BOND 1029, Chomerics Distributors

This electrically conductive silver epoxy allows for quick, cold-soldering repairs. It is considered a solder replacement epoxy for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. High electrical conductivity Convenient 1 to 1 mix ratio Cures at room temperature SVHC free Long shelf life.

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